This paper mainly describes equipment manufacturers have modified the existing equipment with flexible method and vision system scheme according to the characteristics of flip chip to realize the automation of pick and place machine.
英
美
- 介紹了設備的制造廠(chǎng)家根據倒裝芯片的特點(diǎn) ,采用柔性 (軟件 )方法和視覺(jué)系統等方案對現有的設備進(jìn)行改型 ,從而實(shí)現了貼裝設備的自動(dòng)化。