This paper describes the development of solder resist for laser direct imaging(LDI), can rises position alignment accuracy of solder resist in high density PCB manafacturing.

 
  • 概述了激光直接成像(LDI)用阻焊劑的開(kāi)發(fā),可以提高高密度PCB制造中阻焊劑的位置重合精度。
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