This model is manufactured by applying the technique combining ceramic process and semicorductor process, featuring an enclosed glass structure with axial leadout at both ends.

 
  • 本型號產(chǎn)品采用陶瓷工藝與半導體工藝相結合的工藝技術(shù)制作而成,為兩端軸向引出線(xiàn)玻璃封裝結構。
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