This is achieved by using a unique multi beam technology, demonstrated in figure 2, which reduces the power density, minimizes the thermal load, and reduces the kerf width in the wafer.是什么意思_This is achieved by using a unique multi beam technology, demonstrated in figure 2, which reduces the power density, minimizes the thermal load, and reduces the kerf width in the wafer.在線(xiàn)翻譯_英語(yǔ)_讀音_用法_例句