Then the key process parameters of laser bonding, including laser power, scanning velocity, and initial temperature, are obtained with the help of scanning experiments.

 
  • 運用該模型計算了不同的工藝參數條件下硅/玻璃的溫度場(chǎng)分布,并由此得出鍵合線(xiàn)寬。
今日熱詞
目錄 附錄 查詞歷史
国内精品美女A∨在线播放xuan