The temperature curve is shown as the following fig for reference. Such curve can effectively reduce the downflow of paste and avoid tin ball produces.

 
  • 回焊溫度曲線(xiàn)乃因晶片元件及基板等的狀能,和回焊爐的型式而異,事前不妨多做測試,以確保最適當的曲線(xiàn)。
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