The substrate with the sheet is heated and pressurized so that the metallic paste is sintered and bonded to the electrode so as to form the bump.

 
  • 對所述基片和所述片材一起進(jìn)行加熱和加壓,從而所述金屬膏被熔化和結合在所述電極上而形成所述凸塊。
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