The semi rigid package system features Bemis EZ Peel?Reseal film, an advanced peelable technology that exposes a pressure sensitive layer when the consumer opens the package.

 
  • 半剛性包裝系統的功能比米斯易剝離?重新封裝薄膜,先進(jìn)的剝離技術(shù),暴露了壓力感應層當消費者打開(kāi)包。
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