The problem is that copper contaminates the junctions, so a thin conductive barrier (one that does not slow the chip down) needs to be placed below it.

 
  • 問(wèn)題是銅會(huì )污染接面,因此接面下方必須放薄薄一層(不會(huì )使晶片變慢)的導電障(conductivebarrier)。
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