The mechanism of bonding,material of improvement bonding and the evaluation method of bonding strength are summarized. The development of this technology which used in MEMS is expected.
英
美
- 對陽(yáng)極鍵合技術(shù)的機理、鍵合基片材料的發(fā)展以及鍵合強度的評價(jià)方法等方面進(jìn)行了綜述和評價(jià),并對陽(yáng)極鍵合技術(shù)在MEMS中的發(fā)展趨勢作出展望。
