The hardware structure of layer 3 switch is introduced and particularly a detailed analysis made of its Board Support Package (BSP) and the system booting procedure.

 
  • 摘要文章介紹了三層交換機的硬件設計構架,重點(diǎn)對其板級支持包(BSP)及系統啟動(dòng)過(guò)程做了詳細的分析;
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