The enhanced adhesion of Cu films on Si substrates under MeV Cl ion beam irradiation was studied through analysis of Scanning Auger Microprobe (SAM) and Secondary Ion Mass Spectroscopy(SIMS).

 
  • 本文通過(guò)用掃描俄歇微探針(SAM)和二次離子質(zhì)譜(SIMS)分析了高能氯離子注 入Cu/Si系統,對Cu薄膜附著(zhù)力增強效應進(jìn)行了研究。
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