The diamond and Fullerene abrasive tools with superfine grains were prepared, and the grinding tests on silicon wafer surface was carried out with this two kinds of abrasive tools.

 
  • 制備了超微粒金剛石和富勒烯研磨工具,并分別進(jìn)行了硅片研磨試驗,詳細分析了兩種材料的研磨特性如表面粗糙度的穩定性、磨料粒度對研磨效果的影響以及研磨材料的顯微結構等。
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