The deformation characteristics of kovar lead and seal ri ng and the copper base are discussed.A suggestion is made on how to improve the design of the base and the reliability of electronic packages.

 
  • 文中對可伐引線(xiàn)、密封圈的應變特征及其對銅基板熱變形的影響進(jìn)行了討論,并提出了改善封裝熱應力的途徑。
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