The Flipchip bonded wafer is expected to increase from 3.4 million (2000) to 26.2 million (2005) wafers.是什么意思_The Flipchip bonded wafer is expected to increase from 3.4 million (2000) to 26.2 million (2005) wafers.在線(xiàn)翻譯_英語(yǔ)_讀音_用法_例句