Tension and fatigue tests on a widely used packaging epoxy molding compound (EMC) were performed under room and high temperatures.

 
  • 對在微電子封裝中應用很廣的環(huán)氧模塑封裝材料進(jìn)行了常溫和高溫下的拉伸、疲勞實(shí)驗。
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