Results show that the induced thermal stress in MCM substrates is highly sensitive to their heating histories as well as the flow fields that develop inside the furnace.

 
  • 結果顯示MCM元件所引發(fā)的熱張力相當易受熱爐內加熱歷史、流場(chǎng)與熱場(chǎng)的影響。
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