Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.

 
  • 回流焊:應用加熱金屬涂敷層的表面和預涂焊膏,熔融,連接和凝固兩個(gè)金屬涂層。
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