Recently, copper electroplating also becomes an important process step for IC device manufacture due to the requirement of Dual Damascene process of copper interconnection.

 
  • 近日來(lái),對IC元件制造而言,由于金屬銅內連接雙鑲嵌制程的需求,電鍍銅也已經(jīng)變成一項重要制程步驟。
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