Of these three error sources, it is found that the tilt of the TO-cap has the greatest effect on the coupling efficiency of the packaging subassemblies.

 
  • 發(fā)現在芯片橫向偏移、芯片傾斜和管帽傾斜這三種操作誤差中,管帽傾斜對封裝組件的耦合效率影響最大。
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