This edition also includes coverage of new topics such as nanotechnology, MEMS, electronic packaging, global climate change, electric and hybrid vehicles, and bioengineering. 這個(gè)版本還包括涵蓋新課題，如納米技術(shù)，微機電系統，電子封裝，全球氣候變化，電動(dòng)和混合動(dòng)力汽車(chē)，生物工程。
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