Jinn P. Chu and C. H. Lin, Copper Seed Layer and A Method for Manufacturing Said Copper Seed Layer, US Patent pending, 2006/10.是什么意思_Jinn P. Chu and C. H. Lin, Copper Seed Layer and A Method for Manufacturing Said Copper Seed Layer, US Patent pending, 2006/10.在線(xiàn)翻譯_英語(yǔ)_讀音_用法_例句