In order to study the applicability of Transient Liquid Phase(TLP) bonding method to Cobalt-based superalloy K640,the bonding test adopting amorphous interlayer was carried out.

 
  • 為考察瞬時(shí)液相(TLP)連接方法對鈷基高溫合金K640合金的適用性,采用非晶態(tài)中間層進(jìn)行連接試驗,觀(guān)察接頭區顯微組織,測試接頭的力學(xué)性能并進(jìn)行斷口分析。
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