In microelectronics, the process of connecting wires from the leads on the package to the bonding pads on the chip. Part of the assembly process.是什么意思_In microelectronics, the process of connecting wires from the leads on the package to the bonding pads on the chip. Part of the assembly process.在線(xiàn)翻譯_英語(yǔ)_讀音_用法_例句