In addition, we reduced the air columns around the cavity and simulated the photonic bandgap and fabricated the devices by E-beam lithography and deep dry etching process.

 
  • 未來(lái)將會(huì )對共振腔的幾何形狀做修正來(lái)符合光傳播時(shí)的場(chǎng)型,并以此設計做出元件并加以量測。
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