In addition, this paper also studys, the 3 major supporting technologies of Flip Chip Bonding technology, for their development would largely impact, the promotion and application of FCB in MCM.

　
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  • 另外，由于芯片倒裝焊接的三種關(guān)鍵支撐技術(shù)的發(fā)展在很大程度上影響著(zhù)MCM中倒裝焊接技術(shù)的普及應用，本文還對三種支撐技術(shù)進(jìn)行了研究。
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