Heating temperature,holding time and the composition of Ti in the active filler alloys effect the microstructure physical model of the joint between CVD diamond thick film and cemented carbide.

 
  • 釬焊加熱溫度、保溫時(shí)間、釬料層的含Ti量對CVD金剛石厚膜與硬質(zhì)合金的接頭結構模型有重要影響。
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