Fractography analyses with scanning electronic microscopy (SEM) were conducted to determine fatigue fracture mechanisms of these two lead-free solders.

 
  • 此外,亦利用掃描式電子顯微鏡(SEM)觀(guān)察表面裂縫與疲勞破斷面,以了解此兩款無(wú)鉛焊錫之疲勞破裂機制。
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