Electroless copper depositing processess are controlled by the kinetics of formal dehyde oxidation reaction, which donate electron for the cathodic reduction of cupric ions.

 
  • 化學(xué)鍍銅反應受甲醛氧化過(guò)程動(dòng)力學(xué)控制,甲醛氧化為銅離子還原提供電子。
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