EPBGA model consists of seven parts, they are heat spreader, molding compound, chip, substrate, thermal vias, solder ball and PCB board.

 
  • EPBGA構裝體由七個(gè)部分所組成,分別為散熱板、成形樹(shù)脂、晶片、基板、熱通孔、錫球及印刷電路板。
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