Dual damascene technology of Cu/ low dielectric layer is introduced in this paper, andthis technology has been used in manufacturing DRAM and logic devices.

 
  • 介紹了銅/介電常數介電層的雙嵌入式工藝,該工藝已大規模應用于動(dòng)態(tài)記憶存儲器(RAM)邏輯電路器件中。
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