Diffusion bonding of Si 3 N 4 to Ni was carried out using non active metal interlayers of FeNi/Cu under high and low vacuum conditions. After bonding,HIP processes were also used for some joints. Joint strength was determined by four-point bending tests.
英
美
- 采用非活性金屬中間層FeNi/Cu在高、低真空條件下進(jìn)行了Si3 N4 陶瓷與Ni的擴散連接 ,然后對部分接頭進(jìn)行了熱等靜壓 (HIP)后處理 ,測定了連接接頭的四點(diǎn)彎曲強度 ,用掃描電鏡 (SEM)、電子探針 (EPMA)和X射線(xiàn)衍射儀 (XRD)對連接界面區域進(jìn)行了分析。
