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- TiO2-W薄膜TiO2-W thin films
- 薄膜film
- 薄膜的pellicular
- W-Cu觸頭材料W-Cu contact materials
- 研究結果表明,在優(yōu)化的工藝條件下,可獲得應力為230 MPa、硬度高達988 HV、無(wú)裂紋的納米晶Ni-W薄膜材料,為其在MEMS微器件、微模具制備上的應用提供了有效途徑.The results show that in the optimum process,the nanocrystalline Ni-W film without crack can be obtained,and its stress is 230 MPa,hardness is 988 HV.In this way,Ni-W film may be widely applied in the manufacture of MEMS device and micro-molding.
- 塑料薄膜plastic membrane
- W／Cu觸頭材料W/Cu contact materials
- Cu-Pb-Zn-W-As-Sb-Bi-Au-AgCu-Pb-Zn-W-As-Sb-Bi-Au-Ag
- 薄膜開(kāi)關(guān)thin film switch
- Mo（W）/S/Cu含簇超分子化合物的合成、結構與性能研究Syntheses, Structures and Properties of Supramolecular Compounds Constructed from the Preformed Mo(W)/S/Cu Clusters
- 薄膜電池hull cell
- 薄膜材料thin-film material
- 薄膜袋bag film
- 薄膜封閉membrane sealed
- 薄膜晶體管sistor
- 透鏡薄膜lens blooming
- 薄膜比擬membrane analogy
- 薄膜厚度film thickness
- 薄膜層thin layer
- 薄膜式diaphragm type servomotor
