Components required to be mounted off the board are not provided with lead forms at the board surface or other mechanical support to prevent lifting of solder land.

 
  • 需要離開(kāi)面板安裝的組件在線(xiàn)路板表面未利用引腳的形狀或其它機械支撐來(lái)防止焊盤(pán)翹起。
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