Based on the thermal conduct theory and cure kinetics,the history of cure temperature and degree of cure was investigated for the orthotropic laminate during curing.

　
英 美
  • 根據熱傳導和固化動(dòng)力學(xué)理論,采用三維有限元方法,對正交各向異性復合材料層合板固化過(guò)程的溫度和固化度歷程及其變化規律進(jìn)行數值模擬研究。
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