As the bath allows the operation at higher current densities,it can be used for the automatic gold plating or rolling gold plating system for the plugs or the edge tabs of printed circuit board.

 
  • 由于該鍍液能在高電流密度下操作,因而在電子工業(yè)中可用于印制電路板插頭及其簧片的自動(dòng)鍍金和高速滾鍍金系統。
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