According to the experimental results, the removing rate of silicon wafer is almost linearly proportional to the working pressure, the rotating speed of the wafer, and the diamond millstone.

 
  • 由實(shí)驗結果得知,加工壓力、晶圓轉速以及磨盤(pán)轉速皆與矽晶圓移除速率幾乎成線(xiàn)性關(guān)系。
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