A high voltage power MOSFET with double Si gate is developed using self aligned ion implantation process. The fabricated device has a BV DS of 120 V, an output power of 5.1 W, a power gain of 8 dB, a transconductance of 650 mS and an f T of 270 MHz.

 
  • 采用硅柵結構的自對準離子注入工藝,研制成功了源漏擊穿電壓BVDS為120V、輸出功率5.;1W、功率增益8dB、跨導650mS、截止頻率fT為270MHz的高壓雙柵功率MOSFET器件。
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